6096778-1: SEMICONDUCTOR DEVICES,UNITIZED.
The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.260 INCHES MAXIMUM IN, overall_height: 0.070 INCHES MAXIMUM IN, overall_length: 0.270 INCHES MAXIMUM IN, mounting_method: PRESS FIT, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-076-9606, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.260 INCHES MAXIMUM IN |
| overall_height | 0.070 INCHES MAXIMUM IN |
| overall_length | 0.270 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| features_provided | HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_type_and_quantity | 10 RIBBON |
| component_name_and_quantity | 16 SEMICONDUCTOR DEVICE DIODE |
| precious_material_and_location | TERMINAL SURFACES GOLD |
| power_rating_per_characteristic | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
| NSN | 5961-01-076-9606 |
| OVERALL HEIGHT | 0.070 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MAXIMUM REVERSE VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION DEGC |
| PRECIOUS MATERIAL | GOLD |
| MOUNTING METHOD | PRESS FIT |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL LENGTH | 0.270 INCHES MAXIMUM IN |
| COMPONENT NAME AND QUANTITY | 16 SEMICONDUCTOR DEVICE DIODE |
| OVERALL WIDTH | 0.260 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |