6088769-1: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.285 INCHES NOMINAL IN, body_height: 0.080 INCHES NOMINAL IN, body_length: 0.400 INCHES NOMINAL IN, special_features: BOTTOM OF PACKAGE SHALL BE FLAT OVER TOTAL SURFACE AREA, features_provided: SCHOTTKY AND W/CLEAR, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-019-2886, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.285 INCHES NOMINAL IN |
| body_height | 0.080 INCHES NOMINAL IN |
| body_length | 0.400 INCHES NOMINAL IN |
| special_features | BOTTOM OF PACKAGE SHALL BE FLAT OVER TOTAL SURFACE AREA |
| features_provided | SCHOTTKY AND W/CLEAR |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| design_function_and_quantity | 4 FLIP-FLOP, D-TYPE |
| NSN | 5962-01-019-2886 |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 4 FLIP-FLOP, D-TYPE |
| BODY WIDTH | 0.285 INCHES NOMINAL IN |
| BODY HEIGHT | 0.080 INCHES NOMINAL IN |
| FEATURES PROVIDED | SCHOTTKY AND W/CLEAR |
| BODY LENGTH | 0.400 INCHES NOMINAL IN |
| SPECIAL FEATURES | BOTTOM OF PACKAGE SHALL BE FLAT OVER TOTAL SURFACE AREA |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.