6086887-6 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6086887-6: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.400 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-246-6485, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6086887-6

NSN: 5962-01-246-6485
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.400 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	0.625 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-10.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-246-6485

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.400 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.400 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND 3-STATE OUTPUT AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.625 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 045Reference document

Same NSN cross-reference

Reference document — Secondary reference

6086394-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 6086887-6?

6086887-6 is a MICROCIRCUIT,MEMORY.

What parts can replace 6086887-6?

There are 2 known substitutes for 6086887-6: ROM/PROM FAMILY 045, 6086394-2. Substitute compatibility should be verified for your specific system.

What is the NSN for 6086887-6?

6086887-6 is cataloged in the U.S. Government catalog under NSN 5962-01-246-6485. This indicates validated use in U.S. government and defense supply chains.

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6086887-6 — MICROCIRCUIT,MEMORY

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