6086393-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6086393-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.560 INCHES MINIMUM AND 0.570 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-099-1190, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6086393-1

NSN: 5962-01-099-1190
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.560 INCHES MINIMUM AND 0.570 INCHES MAXIMUM IN
features_provided	MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-60.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	E-3A A
inclosure_configuration	FLAT PACK
NSN	5962-01-099-1190

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.560 INCHES MINIMUM AND 0.570 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-60.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 6086393-1?

6086393-1 is a MICROCIRCUIT,MEMORY.

What is the NSN for 6086393-1?

6086393-1 is cataloged in the U.S. Government catalog under NSN 5962-01-099-1190. This indicates validated use in U.S. government and defense supply chains.

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6086393-1 — MICROCIRCUIT,MEMORY

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