608394-4 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

608394-4: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.275 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-108-1960, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

608394-4

NSN: 5962-01-108-1960
NIINs: 011081960, 011081962
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.275 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.560 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-108-1960

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT

SUBSTITUTES & CROSS-REFERENCES 3

S82S141R/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 045Reference document

Same NSN cross-reference

Reference document — Secondary reference

613359Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 608394-4?

608394-4 is a MICROCIRCUIT,MEMORY.

What parts can replace 608394-4?

There are 3 known substitutes for 608394-4: S82S141R/883B, ROM/PROM FAMILY 045, 613359. Substitute compatibility should be verified for your specific system.

What is the NSN for 608394-4?

608394-4 is cataloged in the U.S. Government catalog under NSN 5962-01-108-1960. This indicates validated use in U.S. government and defense supply chains.

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608394-4 — MICROCIRCUIT,MEMORY

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