Intel Xeon processors — standard item. Cross-sell heatsink and fan.
PRODUCT OVERVIEW
EMC Data Domain DD670 Processor Heatsink. Key specifications include Drive Bays: Up to 24 x 2.5" or 12 x 3.5", Max Memory: 3TB, PCIe Slots: Up to 7, Form Factor: 2U rack, Power Supply: Dual redundant. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
WHERE IT FITS
PROCESSOR→INTEL_XEON→6043B0053201
SPECIFICATIONS
Drive Bays
Up to 24 x 2.5" or 12 x 3.5"
Max Memory
3TB
PCIe Slots
Up to 7
Power Supply
Dual redundant
Processor Sockets
2
COMPONENT DIAGRAM
TYPICAL APPLICATIONS
Server thermal management and cooling
Hot-swap fan replacement in production environments