The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include material: STEEL COMP 301 OVERALL, body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, hole_diameter: 0.441 INCHES NOMINAL IN, overall_height: 0.075 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-199-9658, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL COMP 301 OVERALL |
| body_width | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| body_length | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| hole_diameter | 0.441 INCHES NOMINAL IN |
| overall_height | 0.075 INCHES NOMINAL IN |
| outside_diameter | 0.654 INCHES NOMINAL IN |
| features_provided | HIGH PERFORMANCE AND INTERNALLY COMPENSATED |
| surface_treatment | PASSIVATE OVERALL |
| inclosure_material | CERAMIC |
| material_thickness | 0.010 INCHES NOMINAL IN |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| NSN | 5962-00-199-9658 |
| TERMINAL SURFACE TREATMENT | TIN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, LINEAR |
| FEATURES PROVIDED | HIGH PERFORMANCE AND INTERNALLY COMPENSATED |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -0.0 TO 70.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |