5E8061/950C2U02: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN, features_provided: HIGH VOLTAGE AND HERMETICALLY SEALED, output_logic_form: COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-183-8148, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| body_height | 0.150 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| body_length | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN |
| features_provided | HIGH VOLTAGE AND HERMETICALLY SEALED |
| output_logic_form | COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 1 BUFFER, HEX |
| NSN | 5962-01-183-8148 |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, HEX |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HIGH VOLTAGE AND HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |