5962-9313404HXX: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_height: 0.320 INCHES MAXIMUM IN, special_features: FLANGE MOUNTED, features_provided: HYBRID AND BURN IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-413-5712, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.320 INCHES MAXIMUM IN |
| special_features | FLANGE MOUNTED |
| features_provided | HYBRID AND BURN IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL0STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 2 PIN AND 1 CASE |
| NSN | 5962-01-413-5712 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 REGULATOR, VOLTAGE, DC |
| BODY HEIGHT | 0.320 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HYBRID AND BURN IN |
| INCLOSURE CONFIGURATION | CAN |
| CURRENT RATING PER CHARACTERISTIC | -7.00 AMPERES MINIMUM OUTPUT SINK AND -3.00 AMPERES MAXIMUM OUTPUT SINK |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |