5962-92190: MICROCIRCUIT ASSEMBLY.
The MICROCIRCUIT ASSEMBLY is a the manufacturer industrial component. Key specifications include output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: SUPPORT OF PREPROVISIONING ITEMS WHICH NAVICP PHILA ACTS AS POINT OF ENTRY, inclosure_configuration: LEADLESS FLAT PACK, design_function_and_quantity: 1 FLIP-FLOP. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-423-3032, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | SUPPORT OF PREPROVISIONING ITEMS WHICH NAVICP PHILA ACTS AS POINT OF ENTRY |
| inclosure_configuration | LEADLESS FLAT PACK |
| design_function_and_quantity | 1 FLIP-FLOP |
| voltage_rating_and_type_per_characteristic | 4.5 VOLTS MINIMUM TOTAL SUPPLY AND 5.5 VOLTS MAXIMUM TOTAL SUPPLY |
| NSN | 5962-01-423-3032 |
| END ITEM IDENTIFICATION | SUPPORT OF PREPROVISIONING ITEMS WHICH NAVICP PHILA ACTS AS POINT OF ENTRY |