5962-9205801MYX: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 2.025 INCHES MAXIMUM IN, body_length: 2.025 INCHES MAXIMUM IN, special_features: DIGITAL SIGNAL PROCESSOR 27 MHZ, QUAD FLAT PACK WITH NONCONDUCTIVE TIEBAR MHz, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: SILICON. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-413-5180, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 2.025 INCHES MAXIMUM IN |
| body_length | 2.025 INCHES MAXIMUM IN |
| special_features | DIGITAL SIGNAL PROCESSOR 27 MHZ, QUAD FLAT PACK WITH NONCONDUCTIVE TIEBAR MHz |
| features_provided | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.116 INCHES MAXIMUM IN |
| end_item_identification | F-16 ACFT |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-413-5180 |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.116 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 PROCESSOR, INPUT/OUTPUT |
| BODY WIDTH | 2.025 INCHES MAXIMUM IN |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| BODY LENGTH | 2.025 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |