5962-90606022A: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM, body_height: 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM, body_length: 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-408-7901, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM |
| body_height | 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM |
| body_length | 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 LEADLESS |
| design_function_and_quantity | 1 FLIP-FLOP |
| maximum_power_dissipation_rating | 104.5 MILLIWATTS |
| NSN | 5962-01-408-7901 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP |
| BODY WIDTH | 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 5.00 MILLIAMPERES MAXIMUM INPUT |
| BODY LENGTH | 8.7 MILLIMETERS MINIMUM AND 9.1 MILLIMETERS MAXIMUM MM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |