The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 2.096 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-338-5504, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| body_length | 2.096 INCHES MAXIMUM IN |
| overall_height | 0.400 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-338-5504 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OVERALL HEIGHT | 0.400 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 1.03 WATTS |