5962-90516: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES NOMINAL IN, body_height: 0.100 INCHES NOMINAL IN, body_length: 0.358 INCHES NOMINAL IN, features_provided: BIPOLAR AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND W/ENABLE AND W/DISABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-388-7522, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES NOMINAL IN |
| body_height | 0.100 INCHES NOMINAL IN |
| body_length | 0.358 INCHES NOMINAL IN |
| features_provided | BIPOLAR AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND W/ENABLE AND W/DISABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-388-7522 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 8 FLIP-FLOP, EDGE TRIGGERED, D-TYPE |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 96.00 MILLIAMPERES MAXIMUM OUTPUT |
| BODY LENGTH | 1.060 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |