The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES NOMINAL IN, body_height: 0.100 INCHES NOMINAL IN, body_length: 0.358 INCHES NOMINAL IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-411-7825, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES NOMINAL IN |
| body_height | 0.100 INCHES NOMINAL IN |
| body_length | 0.358 INCHES NOMINAL IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 LEADLESS |
| design_function_and_quantity | 1 INVERTER |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-411-7825 |
| DESIGN FUNCTION AND QUANTITY | 1 INVERTER |
| BODY LENGTH | 0.358 INCHES NOMINAL IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| BODY HEIGHT | 0.100 INCHES NOMINAL IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |