5962-89664: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES NOMINAL IN, body_height: 0.200 INCHES NOMINAL IN, body_length: 1.490 INCHES NOMINAL IN, overall_width: 0.460 INCHES MAXIMUM IN, overall_height: 0.100 INCHES MAXIMUM IN, overall_length: 0.460 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-313-5191, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES NOMINAL IN |
| body_height | 0.200 INCHES NOMINAL IN |
| body_length | 1.490 INCHES NOMINAL IN |
| overall_width | 0.460 INCHES MAXIMUM IN |
| overall_height | 0.100 INCHES MAXIMUM IN |
| overall_length | 0.460 INCHES MAXIMUM IN |
| special_features | SHIFT RATE - 15 MHZ MHz |
| features_provided | MONOLITHIC AND ELECTROSTATIC SENSITIVE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | FIRST-IN FIRST-OUT |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| NSN | 5962-01-313-5191 |
| OVERALL HEIGHT | 0.100 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.460 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.088 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.460 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.460 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND CASCADABLE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |