5962-8959840MYA: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.120 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_height: 0.430 INCHES MINIMUM AND 0.445 INCHES MAXIMUM IN, body_length: 0.816 INCHES MINIMUM AND 0.838 INCHES MAXIMUM IN, memory_capacity: 128KX8, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-515-6216, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.120 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| body_height | 0.430 INCHES MINIMUM AND 0.445 INCHES MAXIMUM IN |
| body_length | 0.816 INCHES MINIMUM AND 0.838 INCHES MAXIMUM IN |
| memory_capacity | 128KX8 |
| special_features | C,PS'SCRA,',OMIS 0./5 TO PLUS 7.0VOLTS DC SUPPLY VOLTAGE RANGE;MAXIMUM POWER DISSIPATION 1.0W;260 DEGREES CELSIUS LEAD TEMPERATURE SOLDERING 10 SECONDS W |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| specification/standard_data | 5962-8959840MYA GOVERNMENT STANDARD |
| NSN | 5962-01-515-6216 |
| BODY WIDTH | 0.120 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.430 INCHES MINIMUM AND 0.445 INCHES MAXIMUM IN |
| SPECIFICATION/STANDARD DATA | 5962-8959840MYA GOVERNMENT STANDARD |
| BODY LENGTH | 0.816 INCHES MINIMUM AND 0.838 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| SPECIAL FEATURES | C,PS'SCRA,',OMIS 0./5 TO PLUS 7.0VOLTS DC SUPPLY VOLTAGE RANGE;MAXIMUM POWER DISSIPATION 1.0W;260 DEGREES CELSIUS LEAD TEMPERATURE SOLDERING 10 SECONDS W |
| MEMORY CAPACITY | 128KX8 |