5962-8959824MTC: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.400 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.125 INCHES MAXIMUM IN, body_length: 0.830 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-443-5059, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.400 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN |
| body_height | 0.125 INCHES MAXIMUM IN |
| body_length | 0.830 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 155.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 32 FLAT LEADS |
| NSN | 5962-01-443-5059 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.400 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.125 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES NOMINAL INPUT |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 0.830 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 155.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |