5962-8959202XA: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.175 INCHES MAXIMUM IN, body_height: 1.270 INCHES MAXIMUM IN, body_length: 1.270 INCHES MAXIMUM IN, overall_height: 0.450 INCHES NOMINAL IN, features_provided: BURN IN AND LOW POWER AND HYBRID, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-347-5859, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.175 INCHES MAXIMUM IN |
| body_height | 1.270 INCHES MAXIMUM IN |
| body_length | 1.270 INCHES MAXIMUM IN |
| overall_height | 0.450 INCHES NOMINAL IN |
| features_provided | BURN IN AND LOW POWER AND HYBRID |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| inclosure_configuration | CAN |
| NSN | 5962-01-347-5859 |
| OVERALL HEIGHT | 0.450 INCHES NOMINAL IN |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 TRANSCEIVER |
| BODY WIDTH | 0.175 INCHES MAXIMUM IN |
| BODY HEIGHT | 1.270 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND LOW POWER AND HYBRID |
| INCLOSURE CONFIGURATION | CAN |
| BODY LENGTH | 1.270 INCHES MAXIMUM IN |