The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-339-7103, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| body_height | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| end_item_identification | F/A-18 E/F |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-339-7103 |