5962-89513012X: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include overall_width: 0.358 INCHES NOMINAL IN, overall_height: 0.100 INCHES NOMINAL IN, overall_length: 0.358 INCHES NOMINAL IN, features_provided: BURN IN, MIL-STD-883, CLASS B AND COMPATIBLE CMOS AND ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: SILICON. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-424-8123, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 0.358 INCHES NOMINAL IN |
| overall_height | 0.100 INCHES NOMINAL IN |
| overall_length | 0.358 INCHES NOMINAL IN |
| features_provided | BURN IN, MIL-STD-883, CLASS B AND COMPATIBLE CMOS AND ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883 |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | PACER DAWN |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 20 LEADLESS |
| NSN | 5962-01-424-8123 |
| OVERALL HEIGHT | 0.100 INCHES NOMINAL IN |
| INCLOSURE MATERIAL | SILICON |
| SUPPLEMENTARY FEATURES | MAXIMUM LOW LEVEL INPUT VOLTAGE 0.8VDC; MINIMUM HIGH LEVEL INPUT VOLTAGE 2.0 VDC; MINIMUM SETUP TIME, DN TO CP, HIGH OR LOW, DEVICE TYPE 01=2.5NS; 02=2.0 NS; MINIMUM HOLD TIME, DN TO CP, HIGH OR LOW, DEVICE TYPE 01=2.0 NS, =1.5 NS; MINIMUM CP PULSE WIDTH, HIGH OR LOW, DEVICE TYPE 01 = 7.0 NS, 02 = 6.0 NS VDC |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| OVERALL LENGTH | 0.358 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.358 INCHES NOMINAL IN |
| FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND COMPATIBLE CMOS AND ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883 |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |