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Technical Data Sheet
5962-8876001PB ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.405 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND HIGH PERFORMANCE, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-357-6607, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8876001PB
NSN: 5962-01-357-6607
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length0.405 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND HIGH PERFORMANCE
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternDUAL 2 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity8 PRINTED CIRCUIT
NSN5962-01-357-6607
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN 5962-8876001PB MFR MICROCIRCUIT,LINEAR
KEY FEATURES
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
INPUT CIRCUIT PATTERN: DUAL 2 INPUT
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIAL: CERAMIC
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING500.0 MILLIWATTS
INPUT CIRCUIT PATTERNDUAL 2 INPUT
TERMINAL TYPE AND QUANTITY8 PRINTED CIRCUIT
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATORD-4 MIL-M-38510
VERIFIED SUBSTITUTES & CROSS-REFERENCES 15
525037Interchangeable
interchangeable cross-reference
interchangeable
LT1013AMJ-883BInterchangeable
interchangeable cross-reference
interchangeable
HA2-2650B3264Interchangeable
interchangeable cross-reference
interchangeable
5962-88760Interchangeable
interchangeable cross-reference
interchangeable
5962-8876001GAInterchangeable
interchangeable cross-reference
interchangeable
5962-8876002PXInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8876001PB?
5962-8876001PB is a MICROCIRCUIT,LINEAR.
What parts can replace 5962-8876001PB?
There are 15 known substitutes for 5962-8876001PB: 525037, LT1013AMJ-883B, HA2-2650B3264 and 12 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8876001PB?
5962-8876001PB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-357-6607. This indicates validated use in U.S. government and defense supply chains.
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