5962-8871304RA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8871304RA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.075 INCHES NOMINAL IN, body_height: 0.358 INCHES NOMINAL IN, body_length: 0.358 INCHES NOMINAL IN, special_features: UNPROGRAMMED; TERMINAL TYPE GULLWING, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-407-6625, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8871304RA

NSN: 5962-01-407-6625
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.075 INCHES NOMINAL IN
body_height	0.358 INCHES NOMINAL IN
body_length	0.358 INCHES NOMINAL IN
special_features	UNPROGRAMMED; TERMINAL TYPE GULLWING
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-407-6625

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.075 INCHES NOMINAL IN

•

BODY HEIGHT: 0.358 INCHES NOMINAL IN

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

CURRENT RATING PER CHARACTERISTIC: 70.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.075 INCHES NOMINAL IN
BODY HEIGHT	0.358 INCHES NOMINAL IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
CURRENT RATING PER CHARACTERISTIC	70.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PAL
BODY LENGTH	0.358 INCHES NOMINAL IN

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88713Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 5962-8871304RA?

5962-8871304RA is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8871304RA?

There are 2 known substitutes for 5962-8871304RA: ROM/PROM, 5962-88713. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8871304RA?

5962-8871304RA is cataloged in the U.S. Government catalog under NSN 5962-01-407-6625. This indicates validated use in U.S. government and defense supply chains.

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5962-8871304RA — MICROCIRCUIT,MEMORY

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