5962-8867004LB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8867004LB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ONE-TIME PROGRAMMABLE ONLY, features_provided: PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-372-6876, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8867004LB

NSN: 5962-01-372-6876
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

special_features	ONE-TIME PROGRAMMABLE ONLY
features_provided	PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
hybrid_technology_type	MONOLITHIC
end_item_identification	7P BLK 2 DCN,E/I FSCM 49956
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-372-6876

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 16.00 MILLIAMPERES MAXIMUM OUTPUT SINK

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	16.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
SPECIFICATION/STANDARD DATA	67268-5962-88670 GOVERNMENT STANDARD

SUBSTITUTES & CROSS-REFERENCES 7

ROM/PROM HEAD 250Reference document

Same NSN cross-reference

Reference document — Secondary reference

99167583Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8867004LASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

PALC22V10B-20DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

AT22V10-20GM/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88670Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 5962-8867004LB?

5962-8867004LB is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8867004LB?

There are 7 known substitutes for 5962-8867004LB: ROM/PROM HEAD 250, 99167583, 5962-8867004LA and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8867004LB?

5962-8867004LB is cataloged in the U.S. Government catalog under NSN 5962-01-372-6876. This indicates validated use in U.S. government and defense supply chains.

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