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5962-8867002KB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8867002KB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 24 FLAT LEADS, voltage_rating_and_type_per_characteristic: 7.0 VOLTS MAXIMUM POWER SOURCE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-435-2337, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8867002KB
NSN: 5962-01-435-2337
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
memory_device_typePAL
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationFLAT PACK
terminal_type_and_quantity24 FLAT LEADS
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-435-2337
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8867002KB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
SUBSTITUTES & CROSS-REFERENCES 5
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88670Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8867002KXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8867002KASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
PALC22V10-30KMBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 5962-8867002KB?
5962-8867002KB is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8867002KB?
There are 5 known substitutes for 5962-8867002KB: ROM/PROM, 5962-88670, 5962-8867002KX and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8867002KB?
5962-8867002KB is cataloged in the U.S. Government catalog under NSN 5962-01-435-2337. This indicates validated use in U.S. government and defense supply chains.
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