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Technical Data Sheet
PartsTable / COMPONENT / 5962-8867001LA
5962-8867001LA ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.280 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-303-6125, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8867001LA
NSN: 5962-01-303-6125
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
overall_width0.320 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
overall_length1.280 INCHES MAXIMUM IN
special_featuresTRUTH TABLE: PR11468846-107
features_providedPROGRAMMED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
NSN5962-01-303-6125
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 5962-8867001LA MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
TIME RATING PER CHACTERISTIC: 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
TECHNICAL CHARACTERISTICS (FLIS)
TIME RATING PER CHACTERISTIC25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 3
5962-8753901LAInterchangeable
Same NIIN cross-reference
interchangeable
ROM/PROMInterchangeable
Same NIIN cross-reference
interchangeable
9931-BGGLInterchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8867001LA?
5962-8867001LA is a MICROCIRCUIT,DIGITAL.
What parts can replace 5962-8867001LA?
There are 3 known substitutes for 5962-8867001LA: 5962-8753901LA, ROM/PROM, 9931-BGGL. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8867001LA?
5962-8867001LA is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-303-6125. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026