5962-88670013X — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-88670013X: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-307-5787, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-88670013X

NSN: 5962-01-307-5787
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-307-5787

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 16.00 MILLIAMPERES NOMINAL OUTPUT SINK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	16.00 MILLIAMPERES NOMINAL OUTPUT SINK
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	C-4 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 6

5962-88670013BReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88670013ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROM HEAD 299Reference document

Same NSN cross-reference

Reference document — Secondary reference

PALC22V10-25LMBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88670Reference document

Same NSN cross-reference

Reference document — Identification reference

AT22V10-25NM/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 5962-88670013X?

5962-88670013X is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-88670013X?

There are 6 known substitutes for 5962-88670013X: 5962-88670013B, 5962-88670013A, ROM/PROM HEAD 299 and 3 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-88670013X?

5962-88670013X is cataloged in the U.S. Government catalog under NSN 5962-01-307-5787. This indicates validated use in U.S. government and defense supply chains.

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5962-88670013X — MICROCIRCUIT,MEMORY

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