5962-8866503ZB: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN, body_length: 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM IN, features_provided: BURN IN AND MONOLITHIC AND HERMETICALLY SEALED AND ASYNCHRONOUS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-374-0104, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM IN |
| body_height | 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN |
| body_length | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM IN |
| features_provided | BURN IN AND MONOLITHIC AND HERMETICALLY SEALED AND ASYNCHRONOUS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | PIN GRID ARRAY |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-374-0104 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN |
| CAPITANCE RATING PER CHARACTERISTIC | 11.00 INPUT PICOFARADS MAXIMUM |
| FEATURES PROVIDED | BURN IN AND MONOLITHIC AND HERMETICALLY SEALED AND ASYNCHRONOUS |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| CURRENT RATING PER CHARACTERISTIC | 250.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |
| CASE OUTLINE SOURCE AND DESIGNATOR | P-AC MIL-M-38510 |