5962-8865302SB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.300 INCHES NOMINAL IN, body_height: 0.100 INCHES NOMINAL IN, body_length: 0.540 INCHES NOMINAL IN, features_provided: BURN IN AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-372-9618, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES NOMINAL IN |
| body_height | 0.100 INCHES NOMINAL IN |
| body_length | 0.540 INCHES NOMINAL IN |
| features_provided | BURN IN AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-372-9618 |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 TRANSCEIVER |
| BODY WIDTH | 0.300 INCHES NOMINAL IN |
| BODY HEIGHT | 0.100 INCHES NOMINAL IN |
| FEATURES PROVIDED | BURN IN AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 1.50 MILLIAMPERES MAXIMUM SUPPLY |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |