5962-8863403YA: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: A/F-18-DCN, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-423-3076, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | PROGRAMMED |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | A/F-18-DCN |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 32 LEADLESS |
| part_name_assigned_by_controlling_agency | PROGRAMMED, CMOS EEPROM |
| voltage_rating_and_type_per_characteristic | 5.0 VOLTS NOMINAL POWER SOURCE |
| NSN | 5962-01-423-3076 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| END ITEM IDENTIFICATION | PACER DAWN |