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5962-8863403YA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8863403YA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: A/F-18-DCN, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-423-3076, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8863403YA
NSN: 5962-01-423-3076
NIINs: 014233076, 014336549, 014439388, 014439391
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
features_providedPROGRAMMED
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
end_item_identificationA/F-18-DCN
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity32 LEADLESS
part_name_assigned_by_controlling_agencyPROGRAMMED, CMOS EEPROM
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-423-3076
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8863403YA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
END ITEM IDENTIFICATIONPACER DAWN
SUBSTITUTES & CROSS-REFERENCES 6
AT28HC256-90LM/883Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8863403YBReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8863403YXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88634Reference document
Same NSN cross-reference
Reference document — Identification reference
X28HC256EMB-90Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 5962-8863403YA?
5962-8863403YA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8863403YA?
There are 6 known substitutes for 5962-8863403YA: AT28HC256-90LM/883, 5962-8863403YB, ROM/PROM and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8863403YA?
5962-8863403YA is cataloged in the U.S. Government catalog under NSN 5962-01-423-3076. This indicates validated use in U.S. government and defense supply chains.
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