5962-88611023X — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-88611023X: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.460 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.460 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 4096, special_features: ESD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-414-5534, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-88611023X

NSN: 5962-01-414-5534
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.460 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.460 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	4096
special_features	ESD
features_provided	ELECTROSTATIC SENSITIVE AND MONOLITHIC AND TESTED TO MIL-STD-883
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-414-5534

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

WORD QUANTITY: 4096

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.460 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND MONOLITHIC AND TESTED TO MIL-STD-883

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
WORD QUANTITY	4096
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.460 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND MONOLITHIC AND TESTED TO MIL-STD-883
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	RAM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

5962-88611023ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 5962-88611023X?

5962-88611023X is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-88611023X?

There is 1 known substitute for 5962-88611023X: 5962-88611023A. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-88611023X?

5962-88611023X is cataloged in the U.S. Government catalog under NSN 5962-01-414-5534. This indicates validated use in U.S. government and defense supply chains.

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5962-88611023X — MICROCIRCUIT,MEMORY

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