5962-8859403WB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8859403WB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.111 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 256, overall_height: 0.425 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-341-7955, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8859403WB

NSN: 5962-01-341-7955
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.350 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN
body_height	0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length	1.111 INCHES MAXIMUM IN
bit_quantity	1024
word_quantity	256
overall_height	0.425 INCHES MAXIMUM IN
overall_length	1.111 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-341-7955

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 1024

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

WORD QUANTITY: 256

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.350 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	1024
OVERALL HEIGHT	0.425 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	16 INPUT
WORD QUANTITY	256
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.350 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN
BODY HEIGHT	0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
OVERALL LENGTH	1.111 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND MONOLITHIC

SUBSTITUTES & CROSS-REFERENCES 5

5962-8859403WXReference document

Same NSN cross-reference

Reference document — Secondary reference

CY7C122-25DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

P4C422-25DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8859403WASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-88594Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 5962-8859403WB?

5962-8859403WB is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8859403WB?

There are 5 known substitutes for 5962-8859403WB: 5962-8859403WX, CY7C122-25DMB, P4C422-25DMB and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8859403WB?

5962-8859403WB is cataloged in the U.S. Government catalog under NSN 5962-01-341-7955. This indicates validated use in U.S. government and defense supply chains.

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