5962-88544: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 7.480 INCHES NOMINAL IN, overall_height: 5.390 INCHES NOMINAL IN, overall_length: 9.840 INCHES NOMINAL IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-355-3765, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.280 INCHES MAXIMUM IN |
| overall_width | 7.480 INCHES NOMINAL IN |
| overall_height | 5.390 INCHES NOMINAL IN |
| overall_length | 9.840 INCHES NOMINAL IN |
| memory_capacity | 256K X 1 |
| special_features | PANEL MOUNTING |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND LOW POWER |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| NSN | 5962-01-355-3765 |
| INPUT CIRCUIT PATTERN | 20 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND LOW POWER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |