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5962-8852505XX — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8852505XX: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 262144, word_quantity: 32768, overall_height: 0.432 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-343-2969, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8852505XX
NSN: 5962-01-343-2969
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
bit_quantity262144
word_quantity32768
overall_height0.432 INCHES MAXIMUM IN
overall_length1.490 INCHES MAXIMUM IN
features_providedERASABLE AND W/DISABLE AND MONOLITHIC
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEEPROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
NSN5962-01-343-2969
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8852505XX MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 262144
•
INPUT CIRCUIT PATTERN: 25 INPUT
•
WORD QUANTITY: 32768
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY262144
OVERALL HEIGHT0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN25 INPUT
WORD QUANTITY32768
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
OVERALL LENGTH1.490 INCHES MAXIMUM IN
FEATURES PROVIDEDERASABLE AND W/DISABLE AND MONOLITHIC
SUBSTITUTES & CROSS-REFERENCES 7
28C256E-25DM/883Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8852505XASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8852505XBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88525Reference document
Same NSN cross-reference
Reference document — Identification reference
X28C256DMB-25Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 5962-8852505XX?
5962-8852505XX is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8852505XX?
There are 7 known substitutes for 5962-8852505XX: 28C256E-25DM/883, ROM/PROM, 5962-8852505XA and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8852505XX?
5962-8852505XX is cataloged in the U.S. Government catalog under NSN 5962-01-343-2969. This indicates validated use in U.S. government and defense supply chains.
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