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Technical Data Sheet
PartsTable / COMPONENT / 5962-8851503SB
5962-8851503SB ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-352-1009, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8851503SB
NSN: 5962-01-352-1009
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length0.540 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
end_item_identification5895-01-299-3419 CONVERTER,SIGNAL DATA
NSN5962-01-352-1009
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8851503SB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
•
BODY LENGTH: 0.540 INCHES MAXIMUM IN
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
CURRENT RATING PER CHARACTERISTIC: 55.00 MILLIAMPERES MAXIMUM SUPPLY
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
BODY LENGTH0.540 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN10 INPUT
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CURRENT RATING PER CHARACTERISTIC55.00 MILLIAMPERES MAXIMUM SUPPLY
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
TIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM DELAY NS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
PAL16R6B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 131Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 134Interchangeable
interchangeable cross-reference
interchangeable
PAL16L8B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-88515Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8851503SB?
5962-8851503SB is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8851503SB?
There are 22 known substitutes for 5962-8851503SB: PAL16R6B-4MJ/883B, ROM/PROM, ROM/PROM HEAD 131 and 19 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8851503SB?
5962-8851503SB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-352-1009. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026