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Technical Data Sheet
PartsTable / COMPONENT / 5962-8851503RB
5962-8851503RB ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-296-6828, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8851503RB
NSN: 5962-01-296-6828
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-296-6828
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8851503RB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
INCLOSURE MATERIAL: CERAMIC
•
MEMORY DEVICE TYPE: PAL
•
BODY LENGTH: 1.060 INCHES MAXIMUM IN
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE MATERIALCERAMIC
MEMORY DEVICE TYPEPAL
BODY LENGTH1.060 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
ROM/PROM HEAD 134Interchangeable
interchangeable cross-reference
interchangeable
PAL16L8B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-88515Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
PAL16R4B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-88515032XInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8851503RB?
5962-8851503RB is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8851503RB?
There are 23 known substitutes for 5962-8851503RB: ROM/PROM HEAD 134, PAL16L8B-4MJ/883B, 5962-88515 and 20 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8851503RB?
5962-8851503RB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-296-6828. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026