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Technical Data Sheet
PartsTable / COMPONENT / 5962-88515012B
5962-88515012B ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-360-1550, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-88515012B
NSN: 5962-01-360-1550
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.100 INCHES MAXIMUM IN
body_length0.358 INCHES MAXIMUM IN
features_providedBURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-360-1550
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-88515012B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 303.0 MILLIWATTS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
BODY HEIGHT: 0.100 INCHES MAXIMUM IN
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING303.0 MILLIWATTS
PART NAME ASSIGNED BY CONTROLLING AGENCYMICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
BODY HEIGHT0.100 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN16 INPUT
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 21
PAL16R6B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 131Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 134Interchangeable
interchangeable cross-reference
interchangeable
PAL16L8B-4MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
5962-88515Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-88515012B?
5962-88515012B is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-88515012B?
There are 21 known substitutes for 5962-88515012B: PAL16R6B-4MJ/883B, ROM/PROM, ROM/PROM HEAD 131 and 18 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-88515012B?
5962-88515012B is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-360-1550. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026