5962-8777801YX: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.980 INCHES MINIMUM AND 1.020 INCHES MAXIMUM IN, body_height: 0.270 INCHES MINIMUM AND 0.352 INCHES MAXIMUM IN, body_length: 1.513 INCHES MINIMUM AND 1.553 INCHES MAXIMUM IN, overall_height: 0.690 INCHES MINIMUM AND 0.832 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND POSITIVE OUTPUTS, inclosure_material: METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-292-2108, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.980 INCHES MINIMUM AND 1.020 INCHES MAXIMUM IN |
| body_height | 0.270 INCHES MINIMUM AND 0.352 INCHES MAXIMUM IN |
| body_length | 1.513 INCHES MINIMUM AND 1.553 INCHES MAXIMUM IN |
| overall_height | 0.690 INCHES MINIMUM AND 0.832 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND POSITIVE OUTPUTS |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-292-2108 |
| OVERALL HEIGHT | 0.690 INCHES MINIMUM AND 0.832 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 ARRAY, DIODE-TRANSISTOR |
| BODY WIDTH | 0.980 INCHES MINIMUM AND 1.020 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.270 INCHES MINIMUM AND 0.352 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-3 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |