5962-8765101LA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8765101LA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-370-0381, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8765101LA

NSN: 5962-01-370-0381
NIINs: 013700381, 013700382, 013700383, 013817386
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
features_provided	PROGRAMMED
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
end_item_identification	AN/FPS-124
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-370-0381

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510

•

SPECIFICATION/STANDARD DATA: 56232-1219252 MANUFACTURERS SPECIFICATION CONTROL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
SPECIFICATION/STANDARD DATA	56232-1219252 MANUFACTURERS SPECIFICATION CONTROL
DEPARTURE FROM CITED DOCUMENT	ALTERED BY PROGRAMMING,MARKING & TESTING
NONDEFINITIVE SPEC/STD DATA	201 NUMBER

SUBSTITUTES & CROSS-REFERENCES 2

1219252-201Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 5962-8765101LA?

5962-8765101LA is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8765101LA?

There are 2 known substitutes for 5962-8765101LA: 1219252-201, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8765101LA?

5962-8765101LA is cataloged in the U.S. Government catalog under NSN 5962-01-370-0381. This indicates validated use in U.S. government and defense supply chains.

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