5962-87574: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 2.096 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND DYNAMIC AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-231-3787, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN |
| body_height | 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| body_length | 2.096 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND DYNAMIC AND BIPOLAR AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 24 INPUT |
| end_item_identification | 1260-01-208-6448 |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-231-3787 |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-5 MIL-M-38510 |
| END ITEM IDENTIFICATION | 1260-01-208-6448 |
| TERMINAL TYPE AND QUANTITY | 44 LEADLESS |