5962-8757301YC: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.340 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.740 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-264-0745, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.340 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| body_length | 0.740 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-264-0745 |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PRECIOUS MATERIAL | GOLD |
| DESIGN FUNCTION AND QUANTITY | 1 CONTROL |
| BODY WIDTH | 0.340 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-11 MIL-M-38510 |