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5962-8753902B3X — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8753902B3X: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-302-3422, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8753902B3X
NSN: 5962-01-302-3422
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern22 INPUT
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-302-3422
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8753902B3X MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 22 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: PAL
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN22 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
BODY HEIGHT0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORC-4 MIL-M-38510
BODY LENGTH0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 9
5962-87539023XReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-87539023ASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
PALC22V10-30QMBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8753902B3BReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-87539023BReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-87539Reference document
Same NSN cross-reference
Reference document — Identification reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 5962-8753902B3X?
5962-8753902B3X is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8753902B3X?
There are 9 known substitutes for 5962-8753902B3X: 5962-87539023X, 5962-87539023A, PALC22V10-30QMB and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8753902B3X?
5962-8753902B3X is cataloged in the U.S. Government catalog under NSN 5962-01-302-3422. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.