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Technical Data Sheet
5962-8751505KX ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_device_type: PROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 20 FLAT LEADS, time_rating_per_chacteristic: 45.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS, part_name_assigned_by_controlling_agency: EPROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-434-9097, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8751505KX
NSN: 5962-01-434-9097
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
memory_device_typePROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationFLAT PACK
terminal_type_and_quantity20 FLAT LEADS
time_rating_per_chacteristic45.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
part_name_assigned_by_controlling_agencyEPROM
voltage_rating_and_type_per_characteristic7.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-434-9097
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8751505KX MFR MICROCIRCUIT,MEMORY
KEY FEATURES
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY: 20 FLAT LEADS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS NOMINAL POWER SOURCE
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
INCLOSURE CONFIGURATION: FLAT PACK
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEPROM
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYEPROM
TERMINAL TYPE AND QUANTITY20 FLAT LEADS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS NOMINAL POWER SOURCE
TIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
INCLOSURE CONFIGURATIONFLAT PACK
VERIFIED SUBSTITUTES & CROSS-REFERENCES 27
5962-8751506LAInterchangeable
interchangeable cross-reference
interchangeable
28721-1600-0016Interchangeable
interchangeable cross-reference
interchangeable
5962-8751506LXInterchangeable
interchangeable cross-reference
interchangeable
AT27HC641R70LM/883Interchangeable
interchangeable cross-reference
interchangeable
5962-8751503B3XInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8751505KX?
5962-8751505KX is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8751505KX?
There are 27 known substitutes for 5962-8751505KX: 5962-8751506LA, 28721-1600-0016, 5962-8751506LX and 24 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8751505KX?
5962-8751505KX is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-434-9097. This indicates validated use in U.S. government and defense supply chains.
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