5962-8751402YX — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8751402YX: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: EEPROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 32 LEADLESS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-412-5953, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8751402YX

NSN: 5962-01-412-5953
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

inclosure_material	CERAMIC
memory_device_type	EEPROM
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	32 LEADLESS
time_rating_per_chacteristic	300.00 NANOSECONDS MAXIMUM ACCESS NS
part_name_assigned_by_controlling_agency	PROGRAMMABLE CMOS 8K X 8 EEPROM
voltage_rating_and_type_per_characteristic	6.25 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-412-5953

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: EEPROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 6.25 VOLTS MAXIMUM POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 32 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	EEPROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.25 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY	PROGRAMMABLE CMOS 8K X 8 EEPROM
TERMINAL TYPE AND QUANTITY	32 LEADLESS
TIME RATING PER CHACTERISTIC	300.00 NANOSECONDS MAXIMUM ACCESS NS

SUBSTITUTES & CROSS-REFERENCES 5

5962-87514Reference document

Same NSN cross-reference

Reference document — Identification reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8751402YBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8751402YASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

X28C64EMB-30Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Normally procured from the manufacturer (OEM)Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 5962-8751402YX?

5962-8751402YX is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8751402YX?

There are 5 known substitutes for 5962-8751402YX: 5962-87514, ROM/PROM, 5962-8751402YB and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8751402YX?

5962-8751402YX is cataloged in the U.S. Government catalog under NSN 5962-01-412-5953. This indicates validated use in U.S. government and defense supply chains.

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