5962-8700213UB: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN, body_length: 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN, special_features: DUAL PORT, features_provided: STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-398-1252, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN |
| body_height | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN |
| body_length | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN |
| special_features | DUAL PORT |
| features_provided | STATIC OPERATION |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-398-1252 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN |
| FEATURES PROVIDED | STATIC OPERATION |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 185.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |