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5962-8687511XA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8687511XA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 2.435 INCHES MAXIMUM IN, features_provided: BURN IN, MIL-STD-883, CLASS B, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-360-7134, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8687511XA
NSN: 5962-01-360-7134
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height0.210 INCHES MAXIMUM IN
body_length2.435 INCHES MAXIMUM IN
features_providedBURN IN, MIL-STD-883, CLASS B
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationCAN
terminal_surface_treatmentSOLDER
terminal_type_and_quantity48 PIN
current_rating_per_characteristic50.00 MILLIAMPERES NOMINAL OUTPUT
NSN5962-01-360-7134
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8687511XA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.210 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN, MIL-STD-883, CLASS B
•
INCLOSURE CONFIGURATION: CAN
•
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
•
MEMORY DEVICE TYPE: RAM
•
BODY LENGTH: 2.435 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT0.210 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN, MIL-STD-883, CLASS B
INCLOSURE CONFIGURATIONCAN
CURRENT RATING PER CHARACTERISTIC50.00 MILLIAMPERES NOMINAL OUTPUT
MEMORY DEVICE TYPERAM
BODY LENGTH2.435 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SUBSTITUTES & CROSS-REFERENCES 4
CY7C140-55DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8687511XXReference document
Same NSN cross-reference
Reference document — Secondary reference
IDT7140SA-55CBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-86875Reference document
Same NSN cross-reference
Reference document — Identification reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 5962-8687511XA?
5962-8687511XA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8687511XA?
There are 4 known substitutes for 5962-8687511XA: CY7C140-55DMB, 5962-8687511XX, IDT7140SA-55CB and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8687511XA?
5962-8687511XA is cataloged in the U.S. Government catalog under NSN 5962-01-360-7134. This indicates validated use in U.S. government and defense supply chains.
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