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5962-8687506YA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8687506YA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN, body_length: 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND BIDIRECTIONAL, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-313-0660, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8687506YA
NSN: 5962-01-313-0660
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN
body_height0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
body_length0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND BIDIRECTIONAL
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern42 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-313-0660
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8687506YA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 42 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND BIDIRECTIONAL
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN42 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN
BODY HEIGHT0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND BIDIRECTIONAL
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEROM
BODY LENGTH0.554 INCHES MINIMUM AND 0.572 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 7
5962-8687506YBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8687506BYAReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8687506BYBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-86875Reference document
Same NSN cross-reference
Reference document — Identification reference
IDT7130LA-70L48BReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8687506BYXReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 5962-8687506YA?
5962-8687506YA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8687506YA?
There are 7 known substitutes for 5962-8687506YA: 5962-8687506YB, 5962-8687506BYA, 5962-8687506BYB and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8687506YA?
5962-8687506YA is cataloged in the U.S. Government catalog under NSN 5962-01-313-0660. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.