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5962-8685906XA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8685906XA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-304-4396, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8685906XA
NSN: 5962-01-304-4396
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)
SPECIFICATIONS
body_width0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern22 INPUT
inclosure_configurationLEADLESS FLAT PACK
time_rating_per_chacteristic55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
NSN5962-01-304-4396
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8685906XA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 22 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
CASE OUTLINE SOURCE AND DESIGNATOR: C-11 MIL-M-38510
•
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN22 INPUT
INCLOSURE MATERIALCERAMIC
BODY WIDTH0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATORC-11 MIL-M-38510
BODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SUBSTITUTES & CROSS-REFERENCES 7
5962-8685906BXAReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8685906BXBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8685906BXXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8685906XXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8685906XBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-86859Reference document
Same NSN cross-reference
Reference document — Identification reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 5962-8685906XA?
5962-8685906XA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8685906XA?
There are 7 known substitutes for 5962-8685906XA: 5962-8685906BXA, 5962-8685906BXB, 5962-8685906BXX and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8685906XA?
5962-8685906XA is cataloged in the U.S. Government catalog under NSN 5962-01-304-4396. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.