5962-8685904LC: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM, body_height: 4.40 MILLIMETERS MAXIMUM MM, body_length: 32.51 MILLIMETERS MAXIMUM MM, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-407-6691, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM |
| body_height | 4.40 MILLIMETERS MAXIMUM MM |
| body_length | 32.51 MILLIMETERS MAXIMUM MM |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 24 PIN |
| NSN | 5962-01-407-6691 |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 4.40 MILLIMETERS MAXIMUM MM |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 115.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| BODY LENGTH | 32.51 MILLIMETERS MAXIMUM MM |