The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, body_height: 0.105 INCHES MAXIMUM IN, overall_length: 0.080 INCHES MINIMUM AND 0.105 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.500 INCHES MINIMUM IN, overall_diameter: 0.209 INCHES MINIMUM AND 0.219 INCHES MAXIMUM IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-266-6161, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| body_height | 0.105 INCHES MAXIMUM IN |
| overall_length | 0.080 INCHES MINIMUM AND 0.105 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES MINIMUM IN |
| overall_diameter | 0.209 INCHES MINIMUM AND 0.219 INCHES MAXIMUM IN |
| features_provided | BURN IN AND HERMETICALLY SEALED CASE |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.219 INCHES MAXIMUM IN |
| NSN | 5962-01-266-6161 |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
| BODY OUTSIDE DIAMETER | 0.219 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | METAL |
| BODY HEIGHT | 0.105 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 REFERENCE, VOLTAGE, ANALOG |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-46 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |